Brian Jeffrey
Da Nang is seeking investors for a cutting-edge semiconductor packaging laboratory project, estimated to cost around $70 million, which aims to enhance chip production and AI innovation in Vietnam.
The Da Nang Department of Finance has announced an invitation for potential investors to apply for approval regarding investment policies and investor selection for this advanced semiconductor packaging lab initiative.
Proposed by VSAP LAB JSC, the project encompasses a total investment of around 1,800 billion VND (approximately 70 million USD). It is set to be developed in the second Da Nang Software Park, situated in Hai Chau District, occupying an area exceeding 2,200 square meters.
This four-story lab will feature cutting-edge facilities designed to facilitate the research, production, and testing of semiconductor technologies.
The project will prioritize R&D in both the semiconductor industry and artificial intelligence, while also developing high-tech electrical and electronic products.
Additionally, it will offer various technical services, including inspection, analysis, installation, maintenance, consulting, and training relevant to manufacturing practices.
With a planned capacity of producing 10 million units annually, construction is anticipated to commence in the second quarter of 2025, with completion expected by the fourth quarter of 2026. The facility is set to function for 50 years following investment approval.
The Da Nang Department of Finance mentioned that investor applications will be open from May 10 to May 24. The selection process will establish both the investment policy and the chosen investor without necessitating a land use rights auction or public bidding.
