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ARTICLE AD BOX
Modern electronics power everything from smartphones to satellites, but they all share a major limitation. Heat. Once temperatures climb above roughly 200 degrees Celsius, most devices begin to break down. For decades, this thermal barrier has been one of the toughest challenges in engineering.
Researchers at the University of Southern California now believe they have found a way past that limit.
In a study published on March 26, 2026 in Science
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English (US) ·